Join our Team
About this opportunity:
Are you passionate about pushing the boundaries of integrated circuit (IC) design beyond traditional chip delivery? Do you thrive in an environment where research meets innovation, exploring novel circuit solutions across different technologies and applications? If so, we invite you to join our team as an IC Design & Integration Researcher.
In this role, you will go beyond conventional IC design, investigating new circuit architectures and methodologies tailored to evolving semiconductor technologies. Your work will contribute to groundbreaking solutions in Multi-Chip Modules (MCMs), 2D-3D integration, and their impact on system-level performance.
What you will do:
- Conducting research studies across multiple technology nodes, measurements, or computer simulations and effectively documenting and communicating results.
- Creating new circuit solutions and protecting them through Intellectual Property Rights (IPR).
- Representing Ericsson in university collaborations, as well as in customer and supplier meetings.
- Influencing Ericsson’s research strategies to help shape the future of our technologies.
- Developing evaluation tools, demonstrators, or Proof of Concepts to validate new ideas.
- Exploring the potential of heterogeneous integration and advanced packaging for enhanced system performance.
- Identifying new opportunities at the system level enabled by cutting-edge integration techniques.
The skills you bring:
Essential Qualifications:
- PhD in Electrical Engineering, Microelectronics, or a related field, or equivalent research experience with a strong publication record.
- Hands-on expertise in the design, layout, and measurement of analog, mixed-signal, or RF IC design, with a strong curiosity for cross-domain applications.
- Proficiency with design tools and simulators such as Cadence Spectre, Virtuoso, Calibre, Momentum.
- Solid analytical and problem-solving skills with the ability to address complex technical challenges.
Preferred Skills and Experience:
- Understanding of integration aspects, including chip integration, package/PCB technology, and package design and simulations.
- Knowledge of RF IC transceiver architectures, system design, and tradeoffs for both device and base station applications.
- Experience with tools like Ansys HFSS, Allegro, or equivalent for package and PCB design.
- Familiar with system-level simulations using tools like Matlab or Simulink.
Why join Ericsson?
At Ericsson, you´ll have an outstanding opportunity. The chance to use your skills and imagination to push the boundaries of what´s possible. To build solutions never seen before to some of the world’s toughest problems. You´ll be challenged, but you won’t be alone. You´ll be joining a team of diverse innovators, all driven to go beyond the status quo to craft what comes next.
What happens once you apply?
Click Here to find all you need to know about what our typical hiring process looks like.
Encouraging a diverse and inclusive organization is core to our values at Ericsson, that's why we champion it in everything we do. We truly believe that by collaborating with people with different experiences we drive innovation, which is essential for our future growth. We encourage people from all backgrounds to apply and realize their full potential as part of our Ericsson team. Ericsson is proud to be an Equal Opportunity Employer. learn more.
Primary country and city: Sweden (SE) || Lund
Req ID: 759872
